Cx31993 Datasheet Fix Hot Upd Jun 2026

PCB placement: nearby heat sources or blocking copper planes Fix: Move heat-generating parts away from the CX31993. Ensure inner planes don’t trap heat—use thermal relief and vias to move heat to larger planes.

The datasheet currently lacks a power derating graph. A new graph must be added indicating that maximum power dissipation must be reduced linearly above an ambient temperature of 50°C to prevent junction temperatures exceeding 125°C. cx31993 datasheet fix hot

With headphones connected, play a 1kHz sine wave at 50% volume. Use an oscilloscope probe on L_OUT (pin 18). Look for high-frequency ripple (>1MHz) riding on the signal. If present → oscillation. PCB placement: nearby heat sources or blocking copper

| Parameter | Value | Implication | |-----------|-------|--------------| | Supply Voltage (VDD) | 3.0V – 3.6V (Typ. 3.3V) | Exceeding 3.6V causes excess current draw → heat | | Core Current (Icore) | 18 mA (typical) | Baseline power ~60mW | | Headphone Amp Current (Ihp) | Up to 35 mA per channel | Total chip current can reach 88 mA | | Max Junction Temp (Tj) | 125°C | Case temp of 70°C+ indicates internal issues | | Thermal Resistance (θja) | 52 °C/W (QFN package) | Without PCB heatsinking, temp rises ~5°C per 10mW over spec | A new graph must be added indicating that